诚领多层线路板 PCB PCBA PCB元器件组装

Multilayer board, 26L HDI PCB,FR-4

Product Description:

Place of Origin:	Guang dong, China (Mainland)	Brand Name:	O-Le*g	Model Number:	power bank pcb assembly pcba manufacturer
Base Material:	NPG-150N	Copper Thickness:	1oz	Board Thickness:	0.1-5mm
Min. Hole Size:	0.2mm	Min. Line Width:	2.35mil	Min. Line Spacing:	3mil
Surface Finishing:	immersion gold	color:	green	price:	$0.1-$10
applicable to:	Industry co*ol	character:	Industrial Co*ol	size:	0.01m3-10m3
certificates:	ISO9001,UL,RoHS,SGS	Q/CTN:	10PCS-100PCS	desigh type:	customer requirement
weight:	0.01kg -5kg	MOQ:	10pcs		<*n style="font-size:9pt;">

Packaging & Delivery

Packaging Details:	16 years professional OEM client board manufacturer
Delivery Detail:	7-12days

Product Description

item	2017	2018~2020	2021~2023
Volume	Sample	Volume	Sample	Volume	Sample
Layer count	32	42	38	44	42	48
Min Line/*ce (μm)	50/50	40/45	40/45	40/40	35/40	35/35
Min drill hole diameter (mm)	0.15	0.10	0.15	0.10	0.15	0.10
Aspect ratio of PTH	14:1	16:1	16:1	18:1	18:1	20:1
N+C+N	4+C+4	5+C+5	5+C+5	6+C+6	5+C+5	6+C+6
Any layer interconnection	5+2+5	6+2+6	5+2+5	6+2+6	5+2+5	6+2+6
Plate filling via	YES	--	YES	--	YES	--
Min. core thickness (exclude copper) (μm)	50	40	40	thirty	40	thirty
Min. Laser Drill diameter (μm)	75	65	65	50	50	40
Via on buried hole/stacked via	YES	--	YES	--	YES	--
Material	FR4, Megtron, Nelco, Rogers, He*y Copper, etc.
Embedded capacitor PCB	YES	--	YES	--	YES	--
Surface Process	Lead-free HASL, ENIG, OSP, silver with immersion, tin of immersion, Flash of gold, Golden finger coating, Selective solid gold coating, Flaking solder mask, carbon ink

26L HDI PCB, one stop provider of PCB & PCBA, Base materila withTachyon-100,high TG material, 5.7mm board thickness, Immersion Tin Printed circuit board ,boa* with back drill

• Multilayer board, 26L HDI PCB,FR-4
• •Layer count: 26L
• •materials: Tachyon-100
• •Board thickness:5.7mm+/-10%mm
• •Boa*ize:457.2*228.6mm
• •Special : 26L HDI PCB
• •No. of holes (pcs):450
• •line w/s:7/12mil
• •Impedance co*ol. Y / N (Tol %):N
• •Surface Finishing:Immersion Tin
• •Solder Mask Silkscreen: Green SM + Coverlay
• •Panelisation:Dim X (mm):400;Dim Y (mm):1450;
• •Routing/Punching:CNC