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诚领超长线路板 软板 软硬结合板 厚铜板

诚领超长线路板 软板 软硬结合板 厚铜板
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诚领超长线路板 软板 软硬结合板 厚铜板产品详情

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  • 沉金线路板 :98.4*140.2
  • 品牌:JOYHOLD
  • 用途:通用
  • 表面工艺:沉金板
  • 基材类型:刚性线路板
  • 型号:pcb

HDI pcb Printed circuit board, led pc*oard manufacturer

  • PCB P / N: 1045633
  • Number of layers: 12L
  • Material: EM-370(5) Mid-TG
  • Board THK: 0.85+/-10% mm
  • Copper thk: 1 1oz
  • The *allest hole size: 0.1 mm
  • Number of holes (pcs.): 980
  • Line w / s: 2.4/2.4mil
  • Impedance co*ol. Y / N (Tol%): N
  • Surface treatment: ENIG+OSP
  • Mask for solder Silkscreen: Green
  • The size of one board: Dim X (mm): 43.2; Dim Y (mm): 62.1
  • Panelisation: Dim X (mm): 98.4; Dim Y (mm): 140.2; No UPS: 4
  • Specially: flaking mask: N
  • Routing / Perforation: CNC
Product Description:
brief information

Place of origin:

Guangdong China (Mainland)

Brand name:

O-Le*g

Model number:

Assembling the power bank pcb pcba manufacturer

Basic Material:

EM-370(5) Mid-TG

Copper thickness:

1oz

Plate thickness:

0.1-5mm

Minimum Hole Size:

0.1mm

Minimum Line width:

0.2mm

Minimum Line *cing:

0.2mm

Surface treatment:

Immersion gold, OSP

Colour:

black

price:

$ 0.1- $ 10

Applicable to:

Lead, mobile phone, air Air conditioners, washing machines

character:

Industrial co*oller

the size:

0.01m3-10m3

Certificates:

ISO9001, UL, RoHS, SGS

Q / CTN:

10pcs-100pcs

Type desigh:

Customer requirement

the weight:

0.01kg-5kg

MOQ:

10 pieces

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Packing & Delivery

Packaging Details:

16-year-old professional OEM client Board Manufacturer

Delivery detail:

7-12days.

Packing & Delivery

Packaging Details: 16-year-old professional OEM client Board Manufacturer

Delivery detail: 7-12days.

paragraph

2017

2018 ~ 2020

2021 ~ 2023

Amount

Sample

Amount

Sample

Amount

Sample

Number of layers

32

42

38

44

42

48

Min. Line / Spacing (μm)

50/50

40/45

40/45

40/40

35/40

35/35

Min. Drilling hole
Diameter (mm)

0,15

0.10

0,15

0.10

0,15

0.10

Aspect Ratio
PTH

14: 1

16: 1

16: 1

18: 1

18: 1

20: 1

N + C + N,

4 + C + 4

5 + C + 5

5 + C + 5

6 + C + 6

5 + C + 5

6 + C + 6

Any layer Relati*hip

5 + 2 + 5

6 + 2 + 6

5 + 2 + 5

6 + 2 + 6

5 + 2 + 5

6 + 2 + 6

Filling of plates through

YES

-

YES

-

YES

-

Minimum Core Thickness (Excluding copper) (μm)

50

40

40

thirty

40

thirty

Minimum Laser Drill Diameter (μm)

75

65

65

50

50

40

Via at the Funeral
Hole / styling through

YES

-

YES

-

YES

-

material

FR4, Megtron, Nelco, Rogers, He*y Copper, etc.

Built-in capacitor printed circuit board

YES

-

YES

-

YES

-

Surface process

Lead-free HASL, ENIG, OSP, silver with immersion, tin of immersion,
Flash of gold, Golden finger coating, Selective solid gold coating,
Flaking solder mask, carbon ink













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