欧盟ROHS2.0哪些物质属于豁免范围
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- 名称深圳市华商检测技术有限公司 【公司网站】
- 所在地中国 广东 深圳 宝安区
- 联系人 余生
- 价格 ¥100元/件 点此议价
- 采购量 不限制
- 发布日期 2020-07-08 10:15 至 长期有效
欧盟ROHS2.0哪些物质属于豁免范围产品详情
- 费用:面谈
- 认证种类:电子行业认证
- 所在地:深圳
- 服务内容:认证
1. 小型日光灯中的含量不得超过5毫克/灯;(2002/95/EC)
Mercury in compact fluorescent lamps not exceeding 5 mg per lamp.
2.一般用途的直立日光灯中的含量不得超过: (2002/95/EC)
- 卤化盐(Halophosphate)< 10毫克
- 正常的三盐(Triphosphate with normal lifetime)< 5毫克
- 长效的三盐(Triphosphate with long lifetime)< 8毫克
Mercury in straight fluorescent lamps for general pures not exceeding:
· Halophosphate 10 mg;
· Triphosphate with normal lifetime 5 mg;
· Triphosphate with long lifetime 8 mg.
3.特殊用途的直式日光灯中的含量;(2002/95/EC)
Mercury in straight fluorescent lamps for special pures.
4.本附录中未特别提及的其它照明灯中的含量; (2002/95/EC)
Mercury in other lamps not specifically mentioned in this Annex.
5.阴射线管(cathode ray tubes)、电子部件(electronic components)和发光管(fluorescent tubes)的玻璃内的铅含量;(2002/95/EC)
Lead in glass of cathode ray tubes, electronic components&nb*nd fluorescent tubes.
6.钢合金中的铅含量不应该超过0.35%、铝合金中铅含量不应该超过0.4%,铜合金中的铅含量不应该超过4%;(2002/95/EC)
Lead&nb*s&nb*n&nb*lloying element in:
· Steel containing up to 0.35 % lead by weight;
· Aluminium containing up to 0.4 % lead by weight;
· Copper&nb*lloy containing up to 4 % lead by weight.
7.--高温融化型焊锡中的铅(如:锡铅焊料合金中铅含量超过85%);(2005/747/EC)
--用于服务器(servers),存储器(storage)和存储阵列(storage&nb*rray systems)和交换、信号产生和传输,以及电信网络管理的网络基础设施设备(network infrastructure equipment for switching, signalling, tran*ission&nb*s well
as network management for telecommunicati*)中焊料中的铅;(2005/747/EC)
--电子陶瓷产品中的铅(如:高压电子装置);(2005/747/EC)
· Lead in high melting temperature type solders (i.e. lead-based&nb*lloys containing 85 % by weight&nbs*bsp;more lead).
· Lead in solders for servers, storage&nb*nd storage&nb*rray systems, network
infrastructure equipment for switching, signaling, tran*ission&nb*s well&nb*s network
management for telecommunication.
· Lead in electronic ceramic parts (e.g. piezoelectronic devices).
8.电气连接的触点(electrical contacts)中镉及镉化合物的使用不限,以及91/338/EEC指令禁止以外的镉镀层中的镉;(2005/747/EC)
Cadmium&nb*nd its compounds in electrical contacts&nb*nd cadmium plating except for
applicati* banned under Directive 91/338/EEC&nb*mending Directive 76/769/EEC
relating to restricti* on the marketing&nb*nd use of certain dangerous substances&nb*nd preparati*.
9.在吸收式电冰箱中作为碳钢冷却系统防腐剂的六价铬。(2002/95/EC)
Hex*alent chromium&nb*s&nb*n&nb*nti-corrosion of the carbon steel cooling system in&nsorption refrigerators.
9a.聚合物(Polymeric)中十溴二苯醚的应用。(2005/717/EC)
DecaBDE in polymeric&nb*pplicati*.
9b.用于铅青铜轴承外壳(lead-bronze bearing shells&nb*nd bushes)的铅;(2005/717/EC)
Lead in lead-bronze bearing shells&nb*nd bushes.
10、顺应针联接系统(compliant pin connector systems)中使用的铅;(2005/747/EC)
Lead used in compliant pin connector systems.
11、热导项枪钉模组(thermal conduction module c-ring)涂层中所用的铅;(2005/747/EC)
Lead&nb*s&nb* coating material for the thermal conduction module c-ring.
12、光学玻璃及滤光玻璃(optical&nb*nd filter glass)中所用的铅;(2005/747/EC)
Lead&nb*nd cadmium in optical&nb*nd filter glass.
13、微处理器针脚及封装联接所使用的含有80-85%铅的复合(含有超过两种组分)焊料中的铅;(2005/747/EC)
Lead in solders c*isting of more than two elements for the connection between the pins&nb*nd the package of microprocessors with&nb* lead content of more than 80%and less than 85% by weight.
14、倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅;(2005/747/EC)
Lead in solders to complete&nb* viable electrical connection between semiconductor die&nb*nd carrier within integrated circuit Flip Chip packages.
15.直立式的钨丝灯,若其灯管含有硅酸盐涂布,则可含铅;(2006/310/EC)
Lead in linear incandescent lamps with silicate coated tubes.
16.卤化铅作为发光源,并用于探照用途的HID灯中,则可含铅;(2006/310/EC)
Lead halide&nb*s radiant&nb*gent in High Intensity Discharge (HID) lamps used for professional reprography&nb*pplication.
17.若铅作为触发源而包含于荧光粉中(铅含量1wt%或更少),且此荧光粉是用于含有如BSP(BaSi205:Pb)等磷光剂的太阳灯(sun tanning lamps)的放电灯管中,或者此荧光粉是用于含有如SMS((Sr,Ba)2MgSi207:Pb)等磷光剂的特殊灯,这些特殊灯的用途包括用于含二氮化合物的电子翻印、平板印刷、补虫灯、光化学或医疗疗程等等,则可含铅;(2006/310/EC)
Lead&nb*s&nb*ctivator in the fluorescent powder (1% lead by weight&nbs*bsp;less) of discharge lamps when used&nb*s sum tanning lamps containing phosphors such&nb*s BSP (BaSi2O5:Pb)&nb*s well&nb*s when used &nb*s speciality lamps for diazo-printing reprography, lithography, insect traps, photochemical&nb*nd curing processes containing phosphors such&nb*s SMS ((Sr,Ba)2MgSi2O7:Pb).
18.铅作为齐(即合金)中的特定成分,如PbBiSn-Hg或PbInSn-Hg中,且此齐作为主要齐,或如PbSn-Hg用于辅助齐中,且这些齐使用于节能灯泡(ESL)中,则可含铅;(2006/310/EC)
Lead with PbBiSn-Hg&nb*nd PbInSn-Hg in specific comiti*&nb*s main&nb*malgam&nb*nd with PbSn-Hg&nb*s&nb*uxiliary&nb*malgam in very compact Energy S*ing Lamps (ESL).
19. LCD中用于保护平面荧光灯(flat fluorescent lamps)的前后支撑物的玻璃中可含氧化铅。(2006/310/EC)
Lead oxide in glass used for bonding front&nb*nd rear substrates of flat fluorescent
lamps used for Liquid Crystal Displays (LCD).
20. 用在硼硅酸盐玻璃表面瓷釉上的印刷油墨中的铅及镉。(2006/691/EC)
Lead&nb*nd cadmium in printing inks for the&nb*pplication of enamels on borosilicate glass.
22.在光纤通讯系统中的稀土铁石榴石法拉第旋转器中的杂质铅。(2006/691/EC)
Lead&nb*s impurity in RIG (rare earth iron garnet) Faraday rotators used for fibre optic communicati* systems.
21.小螺距零部件表面处理中的铅(螺距不超过0.65mm且带镍铁边框的连接器,以及螺距不超过0.65mm且带铜边框的连接器不在豁免范围之内)。(2006/691/EC)
Lead in finishes of fine pitch components other than connectors with&nb* pitch of 0.65mm&nbs*bsp;less with NiFe lead frames&nb*nd lead in finishes of fine pitch components other than connectors with&nb* pitch of 0.65 mm&nbs*bsp;less with copper lead-frames.
22. 通孔盘状及平面陈列陶瓷多层电容器的焊料所含的铅。(2006/691/EC)
Lead in solders for the soldering to machined through hole discoidal&nb*nd planar&nb*rrayceramic multilayer capacitors.
23. 等离子显示屏(PDP)及表面传导式电子发射显示器(SED)构件中所用的氧化铅,比较典型的例子:玻璃前后绝缘层中的氧化铅、总铅电中的氧化铅、黑条(彩色显像管)中的氧化铅、地址电中的氧化铅、阻挡层肋柱中的氧化铅、密封玻璃料中的氧化铅,以及封装玻璃中的氧化铅、环状玻璃中的氧化铅、印墨中的氧化铅。(2006/691/EC)
Lead oxide in pla*a display panels (PDP)&nb*nd surface conduction electron emitterdisplays (SED) used in structural elements; notably in the front&nb*nd rear glass dielectric layer, the bus electrode, the black stripe, the&nb*ddress electrode, the barrier ribs, the seal frit&nb*nd frit ring&nb*s well&nb*s in print pastes.
24.蓝黑灯管(BLB)玻璃封装中的氧化铅。(2006/691/EC)
Lead oxide in the glass envelope of Black Light Blue (BLB) lamps.
25. 用作扬声器(用在长时间操作125分贝以上的音响系统)的传感器中焊料的铅合金。(2006/691/EC)
designated to operate for several hours&nb*t&nb*coustic power levels of 125 dB SPL&nb*ndabove) loudspeakers.
26. 用于防腐或屏蔽电磁干扰,用在特定仪器设备中(欧盟指令2002/96/EC第三类规定的IT和通讯设备)的金属片或金属扣件上的防腐涂层中的六价铬。这项豁免将于2007年7月1日停止。(2006/692/EC)
Hex*alent chromium in corrosion preventive coatings of unpainted metal sheetings&nb*nd fasteners used for corrosion protection&nb*nd Electromagnetic Interference Shielding in equipment falling under category three of Directive 2002/96EC ) (IT&nb*nd telecommunicati* equipment).Exemption granted until 1 July 2007.
27. 水晶玻璃中铅含量的限定依照欧盟指令69/493/EEC附件I2、3、4类)。(2006/690/EC)
Lead bound in crystal glass&nb*s defined in Annex I (Categories1, 2, 3,&nb*nd 4) of Council Directive 69/496/EEC
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